BOSTON | APRIL 30 - MAY 3 | 2018

 

ABOUT THE DIELINE CONFERENCE

Featuring an international lineup of speakers from some of the world’s top brands and agencies, The Dieline Conference is the most inspirational and comprehensive package design and branding conference of its kind. For its eighth year it returns to Boston, a vibrant city and the ideal center for designers to gather, connect, and better understand the power of packaging design. 

Since its inception, The Dieline Conference has been produced and co-located at HOW Design Live. You ticket to The Dieline Conference makes you a part of a global happening, with over 4,000 attendees from every U.S. state and from countries all around the world.  In addition to The Dieline Conference sessions, you can attend all of the HOW Design Live's programming including all keynotes and sessions. You can preview new tools, technologies, and products from up to 100 vendors in the exhibit hall. By attending, you join a creative community embraces everyone and empowers real opportunities.

 

Snapshots of The Dieline Conference 2017: CHICAGO

 

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Snapshots of The Dieline Conference 2016: ATLANTA

View more on Flickr 

 
 

Snapshots of The Dieline Conference 2015: CHICAGO

 

Snapshots of The Dieline Conference 2014: bOSTON

 

SNAPSHOTS OF the dieline conference 2013: San Francisco 

 
 

Snapshots of the dieline conference 2012: BOSTON

 
 

Snapshots of the dieline conference 2011: CHICAGO

 
 
 

Registration Opens Soon 

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